Taiwan Semiconductor Manufacturing or TSMC
2330
opened Advanced Backend Fab 6, a packaging and testing fabrication plant located in Zhunan Science Park, Miaoli, northern Taiwan, according to a Thursday press release.
The facility, which commenced construction in 2020, was built to mass-produce the company's SoIC (System on Integrated Chips) process technology.
The fab has a base area of 14.3 hectares, making it TSMC's largest advanced backend fab to date, the chipmaker said.
It is estimated to have an annual production capacity of over 1 million 12-inch wafer equivalent 3DFabric process technology and more than 10 million hours of testing services.
2330
opened Advanced Backend Fab 6, a packaging and testing fabrication plant located in Zhunan Science Park, Miaoli, northern Taiwan, according to a Thursday press release.
The facility, which commenced construction in 2020, was built to mass-produce the company's SoIC (System on Integrated Chips) process technology.
The fab has a base area of 14.3 hectares, making it TSMC's largest advanced backend fab to date, the chipmaker said.
It is estimated to have an annual production capacity of over 1 million 12-inch wafer equivalent 3DFabric process technology and more than 10 million hours of testing services.
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Disclaimer
The information and publications are not meant to be, and do not constitute, financial, investment, trading, or other types of advice or recommendations supplied or endorsed by TradingView. Read more in the Terms of Use.