Get started
CCC

CLP Power Hong Kong Financing Ltd. 2.25% 21-JUL-2031

No trades
See on Supercharts
Overview Chart
Analysis

CLPHF5233005 analysis


OverviewCouponRedemptionRisks

Key facts


Issuer
CLP Power Hong Kong Financing Ltd.
Issue date
Jul 21, 2021
Maturity date
Jul 21, 2031
Outstanding amount
‪300.00 M‬ USD
Face value
1,000.00 USD
Minimum denomination
200,000.00 USD
Coupon
2.25% (Fixed)
Yield to maturity
4.97%
Go deeper with bond data
Access the most important data for bonds including coupon rates, issue ratings, redemption data and more.