Hillenbrand, Inc. 3.75% 01-MAR-2031Hillenbrand, Inc. 3.75% 01-MAR-2031Hillenbrand, Inc. 3.75% 01-MAR-2031

Hillenbrand, Inc. 3.75% 01-MAR-2031

No trades
See on Supercharts

HI5139698 analysis



Key facts


Issue date
Mar 3, 2021
Maturity date
Mar 1, 2031
Outstanding amount
‪350.00 M‬USD
Face value
1,000.00USD
Minimum denomination
2,000.00USD
Coupon
3.75% (Fixed)
Yield to maturity
6.50%
Hillenbrand, Inc. is a global industrial company, which engages in providing engineered processing equipment and solutions. It operates through the Advanced Process Solutions and Molding Technology Solutions segments. The Advanced Process Solutions segment provides compounding, extrusion, and material handling, screening, and separating equipment, systems, and services for manufacturing and other industrial processes. The Molding Technology Solutions segment includes engineered and customized equipment, systems, and services in plastic technology and processing. It also operates through the following geographical segments: United States, China, India, Germany, and All Other Countries. The company was founded on November 1, 2007 and is headquartered in Batesville, IN.
Go deeper with bond data
Access the most important data for bonds including coupon rates, issue ratings, redemption data and more.