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Hong Kong, China
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Corporate bonds
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LFUG5029889
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Analysis
L
L
L
Li & Fung Limited 5.5% 18-AUG-2025
LFUG5029889
FINRA
LFUG5029889
FINRA
LFUG5029889
FINRA
LFUG5029889
FINRA
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Overview
Analysis
LFUG5029889 analysis
Overview
Coupon
Redemption
Risks
More
Key facts
Issuer
Li & Fung Ltd.
Issue date
Aug 18, 2020
Maturity date
Aug 18, 2025
Outstanding amount
313.32 M
USD
Face value
1,000.00
USD
Minimum denomination
200,000.00
USD
Coupon
5.50% (Fixed)
Yield to maturity
7.47%
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