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QCOM
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Corporate bonds
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QCOM6081111
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Analysis
Qualcomm Incorporated 4.75% 20-MAY-2032
QCOM6081111
FINRA
QCOM6081111
FINRA
QCOM6081111
FINRA
QCOM6081111
FINRA
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QCOM6081111 analysis
Overview
Coupon
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Key facts
Issuer
QUALCOMM, Inc.
Issue date
May 21, 2025
Maturity date
May 20, 2032
Outstanding amount
400.00 M
USD
Face value
1,000.00
USD
Minimum denomination
2,000.00
USD
Coupon
4.75% (Fixed)
Yield to maturity
4.78%
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