TTT

T-Mobile USA, Inc. 3.6% 15-NOV-2060

No trades
See on Supercharts
Overview
Analysis

Key terms


Outstanding amount
‪1.70 B‬USD
Face value
1,000.00USD
Minimum denomination
2,000.00USD
Coupon
3.60% (Fixed)
Coupon frequency
Semi-annual
Yield to maturity
6.89%
Maturity date
Nov 15, 2060
Term to maturity
35 years

About T-Mobile USA, Inc. 3.6% 15-NOV-2060


Issuer
T-Mobile USA, Inc.
Sector
Communications
Industry
Wireless Telecommunications
Home page
Issue date
May 24, 2021
FIGI
BBG010CJ1J91
T-Mobile USA, Inc. engages in the provision of wireless voice, messaging, and data services. It offers different plans for phones and tablets. The company was founded by John W. Stanton in 1994 and is headquartered in Bellevue, WA.
Advanced bond data for paid plans
Unlock important bond data including coupon rates, redemption details, risk assessments, and much more.