Search
Products
Community
Markets
News
Brokers
More
EN
Get started
Markets
/
USA
/
Corporate bonds
/
TMUS5537477
T
T
T
T-Mobile USA, Inc. 5.05% 15-JUL-2033
TMUS5537477
FINRA
TMUS5537477
FINRA
TMUS5537477
FINRA
TMUS5537477
FINRA
Market closed
Market closed
No trades
See on Supercharts
Overview
Analysis
TMUS5537477
chart
Full chart
1 day
5 days
1 month
6 months
Year to date
1 year
5 years
All time
Key terms
Outstanding amount
2.60 B
USD
Face value
1,000.00
USD
Minimum denomination
2,000.00
USD
Coupon
5.05% (Fixed)
Coupon frequency
Semi-annual
Yield to maturity
5.41%
Maturity date
Jul 15, 2033
Term to maturity
8 years
About T-Mobile USA, Inc. 5.05% 15-JUL-2033
Issuer
T-Mobile USA, Inc.
Sector
Communications
Industry
Wireless Telecommunications
Home page
t-mobile.com
Issue date
Feb 9, 2023
FIGI
BBG01F3MKMT1
T-Mobile USA, Inc. engages in the provision of wireless voice, messaging, and data services. It offers different plans for phones and tablets. The company was founded by John W. Stanton in 1994 and is headquartered in Bellevue, WA.
Show more
TMUS5537477
analysis
Advanced bond data for paid plans
Unlock important bond data including coupon rates, redemption details, risk assessments, and much more.
Start trial