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Corporate bonds
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TMUS5584909
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Analysis
T
T
T
T-Mobile USA, Inc. 5.75% 15-JAN-2054
TMUS5584909
FINRA
TMUS5584909
FINRA
TMUS5584909
FINRA
TMUS5584909
FINRA
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Overview
Analysis
TMUS5584909 analysis
Overview
Coupon
Redemption
Risks
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Key facts
Issuer
T-Mobile USA, Inc.
Issue date
May 11, 2023
Maturity date
Jan 15, 2054
Outstanding amount
1.25 B
USD
Face value
1,000.00
USD
Minimum denomination
2,000.00
USD
Coupon
5.75% (Fixed)
Yield to maturity
5.83%
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