Search
Products
Community
Markets
News
Brokers
More
EN
Get started
Markets
/
USA
/
Corporate bonds
/
TMUS5650474
T
T
T
T-Mobile USA, Inc. 6.0% 15-JUN-2054
TMUS5650474
FINRA
TMUS5650474
FINRA
TMUS5650474
FINRA
TMUS5650474
FINRA
Market closed
Market closed
No trades
See on Supercharts
Overview
Analysis
TMUS5650474
chart
Full chart
1 day
5 days
1 month
6 months
Year to date
1 year
5 years
All time
Key terms
Outstanding amount
1.00 B
USD
Face value
1,000.00
USD
Minimum denomination
2,000.00
USD
Coupon
6.00% (Fixed)
Coupon frequency
Semi-annual
Yield to maturity
5.87%
Maturity date
Jun 15, 2054
Term to maturity
29 years
About T-Mobile USA, Inc. 6.0% 15-JUN-2054
Issuer
T-Mobile USA, Inc.
Sector
Communications
Industry
Wireless Telecommunications
Home page
t-mobile.com
Issue date
Sep 14, 2023
FIGI
BBG01J96XMY2
T-Mobile USA, Inc. engages in the provision of wireless voice, messaging, and data services. It offers different plans for phones and tablets. The company was founded by John W. Stanton in 1994 and is headquartered in Bellevue, WA.
Show more
TMUS5650474
analysis
Advanced bond data for paid plans
Unlock important bond data including coupon rates, redemption details, risk assessments, and much more.
Start trial