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603005 fundamentals

Overview Statements Statistics Dividends Earnings Revenue

Key facts

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About

China Wafer Level CSP Co., Ltd. engages in the manufacture of semiconductor CMOS image sensor chips. It provides wafer-level chip size packaging and testing services. The firm's products include biometric identification chips, micro-electromechanical system chips, ambient light sensor chips, medical electronic devices, and radiofrequency chips. The company was founded on June 10, 2005 and is headquartered in Suzhou, China.

Valuation

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Summary

No data available

There's currently no market capitalization, revenue or net income data to show.

Valuation ratios

Growth and Profitability

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Dividends

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No dividends

603005 has never paid dividends and has no current plans to do so.

Financial health

Financial position and solvency of the company