China Wafer Level CSP Co., Ltd. engages in the manufacture of semiconductor CMOS image sensor chips. It provides wafer-level chip size packaging and testing services. The firm's products include biometric identification chips, micro-electromechanical system chips, ambient light sensor chips, medical electronic devices, and radiofrequency chips. The company was founded on June 10, 2005 and is headquartered in Suzhou, China.