603005 fundamentals
Key facts
Market capitalization—
Founded—
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About
China Wafer Level CSP Co., Ltd. engages in the manufacture of semiconductor CMOS image sensor chips. It provides wafer-level chip size packaging and testing services. The firm's products include biometric identification chips, micro-electromechanical system chips, ambient light sensor chips, medical electronic devices, and radiofrequency chips. The company was founded on June 10, 2005 and is headquartered in Suzhou, China.
Valuation
Fundamental metrics to determine fair value of the stock
Growth and Profitability
Company’s recent performance and margins
Dividends
Dividend yield, history and sustainability
603005 does not pay dividends
The company has not previously paid dividends and at the moment there is no information about whether it is going to pay them in the future
Financial health
Financial position and solvency of the company