TongFu Microelectronics Co., Ltd. engages in the business of integrated circuit assembling and testing. Its products include dual in-line package, small outline package, quad flat package, system in package, small outline transistor, dual flat no-lead, quad flat no-lead, ball grid array, flip chip, and bump series. The company was founded om February 4, 1994 and is headquartered in Nantong, China.